In 2018, the global semiconductor manufacturing equipment market was expected to reach $119 billion by 2026, with a CAGR of 8.0%

wallpapers Robot Industry 2020-02-28

• Industry information

In 2018, the global semiconductor manufacturing equipment market was expected to reach $119 billion by 2026, with a CAGR of 8.0%. Machines considered in the scope of the front-end equipment study include wafer manufacturing equipment and wafer processing equipment. Besides, silicon wafer manufacturing equipment under the device consists of saw, laser, and grinding and polishing equipment. Wafer processing equipment comprises chemical vapor deposition machines, lithography tools, etching machines, metering tools, and quality process control equipment. Within the scope of the study, the devices under the back-end equipment include test, assembly, and packaging equipment. The demand for semiconductors has changed rapidly with the introduction of more advanced products and processing technologies used in end-use industries.


 

Today, the integration of semiconductors has become a common factor, thanks to continued innovation in products such as cars, medical devices, smart devices, smart homes, and wearables. Besides, the trend to integrate semiconductors on a single chip is expanding due to consumers' preference for miniaturized products. In this case, semiconductor manufacturing equipment is gaining momentum because it can assemble semiconductors on a single chip. Moreover, emerging areas such as the automotive industry and artificial intelligence are proving to be potential growth factors for semiconductors.This has further boosted the market for semiconductor manufacturing equipment. For example, in a car, safety-related electronic systems cost about $500 per vehicle. Also, ai C is complementary to the growth of the semiconductor manufacturing equipment market due to the integration of semiconductors in data centers. These centers are equipped with artificial intelligence chips that help improve efficiency and reduce operating costs. Because of this, semiconductors are gaining more traction, which pushes the semiconductor further the development of systems and markets.

• Bearing knowledge

The bearing type generally has the front code, the underlying code, and the rear code. In general, the bearing type is only represented by the primary class. The basic model generally contains three parts, type code, size code, and inside diameter code. The rear system is to use letters and numbers to indicate bearing structure, tolerances, and unique material requirements. The leading system is used to indicate the parts of a bearing, represented by letters. Universal bearing (rolling bearing) code method, divided into front code, underlying code, and rear code.


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